TechSearch
International, Inc.
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4801 Spicewood
Springs Rd.,
Suite #150,
Austin, TX 78759
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Tel: 512.372.8887
Fax: 512.372.8889
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 BGA/CSP DEVELOPMENT UPDATE SERVICE
Third Quarter, 2001
The third quarterly BGA/CSP update for 2001 features trends in area array packages for network and workstation/server applications. New products containing CSPs and wafer level packages are introduced, including Casio’s color wristwatch/camera, Ericsson’s Bluetooth‘ phone, and Handspring’s Visor Edge PDA. A special report on the capacity for PBGA and CSP assembly worldwide provides insight into the current economic situation. The report provides a review of flip chip substrate suppliers and discusses flip chip bumping of ICs fabricated with copper instead of aluminum wiring. New CSP and BGA packages from IBM, Intel, and Texas Instruments are highlighted.
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Q3, 2001: BGA/CSP Development Update Service |
| File size: 26.1 kb |
Published: October 2001. |
| Table of Contents |
| 1 |
Network System and Workstation/Server Trends |
| 1.1 |
Celestica |
| 1.2 |
Cisco Systems |
| 1.3 |
IBM Corporation |
| 1.4 |
LSI Logic |
| 1.5 |
Nortel Networks Optical Components |
| 1.6 |
Sun Microsystems |
| 2 |
New CSP and Wafer Level Package Applications |
| 2.1 |
Casio’s Wristwatch/Camera |
| 2.2 |
Ericsson’s Bluetooth™ Phone |
| 2.3 |
Handspring’s Visor Edge PDA with Wafer Level Packages |
| 3 |
PBGA and CSP Capacity Status |
| 4 |
Flip Chip Developments |
| 4.1 |
Flip Chip Substrate Developments |
| 4.2 |
Flip Chip for Copper Interconnect ICs |
| 4.2.1 |
Implications of Copper on Flip Chip Interconnects |
| 5 |
New Package Developments |
| 5.1 |
Intel’s Microprocessor Package |
| 5.2 |
TI’s NanoStar™ Wafer Level Package |
| 5.3 |
IBM’s CCGAs with Heatsinks |
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| List of Figures |
| 2.1 |
Casio’s color wristwatch/camera. |
| 2.2 |
Ericsson’s Bluetooth™ module. |
| 2.3 |
Handspring’s PDA. |
| 3.1 |
Contract assembly PBGA production capacity |
| 5.1 |
Intel BBUL package cross section. |
| 5.2 |
TI’s L/O process. |
| 5.3 |
TI’s BGA using L/O process. |
| List of Tables |
| 1.1 |
Trends in Network and Workstation/Server Applications |
| 4.1 |
Selected Laminate IC Package Substrate Suppliers |
| 5.1 |
Maximum Allowable Mass for New CCGA Packages |
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