- 1.1 Monthly U.S. housing starts
- 2.1 ECP construction
- 2.2 Fan-in WLP structure with low bump
- 3.1 Intel's 14nm Skylake processor
- 3.2 Flip chip as a percentage of PBGA shipments
- 3.3 Subcontractor share of PBGA shipments
- 4.1 PoP market projections (millions of units)